February 16, 2023

TEWS Technologies Extends mPCIe Module Family Into Communications with FPGA-Based 3 Channel High Speed Synch/Asynch Serial Interface

TEWS extends its tradition of delivering high-density I/O solutions with the introduction of a synchronous/asynchronous standard full PCI Express Mini Card module with three high speed serial data communication channels. The TMPE863 is designed for data communications, LAN/WAN networking, traffic control, simulation, telecommunications, and COTS applications.

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January 27, 2023

TEWS Technologies Introduces Extended Temperature High-Density Digital I/O Conduction Cooled PMC Module

TEWS adds to its already broad offering of conduction cooled PMCs with the release of the high-density 64 Digital TTL I/O or 32 Differential I/O TPMC321 module.

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January 20, 2023

Laying of the foundation stone for new company headquarters

On Friday, 20th January 2023, TEWS Technologies GmbH celebrated laying the foundation stone for its new company headquarters at Eggerstedter Weg 14 in Pinneberg. A state-of-the-art new company headquarters will be built by the end of the year on the 6,700 m² site of the former Eggerstedt Barracks. The investment in this project is the […]

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January 19, 2023

TEWS Technologies Launches New Website

We are pleased to announce the launch of our brand-new website with a fresh new look and feel. After a dedicated effort from our entire team, we are excited to officially announce the launch. Our goal with this new website is to provide our visitors with an easier way to learn about TEWS Technologies embedded […]

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