TMPE863

3 Channel High Speed Sync/Async Serial Interface

  • Standard PCI Express Mini Card
  • 3 channels high speed serial data communication
  • Differential I/O lines for EIA-422, EIA-485 Full-Duplex
  • Several communication protocols
    • asynchronous (with oversampling)
    • isochronous
    • HDLC
  • 512 longword FIFO (512 x 32 bit) per channel
  • DMA support
  • Different signal encodings (NRZ, NRZI, FM0, FM1 and Manchester)
  • Multiple clock sources (for a wide bitrate spectrum)
  • 30 pin Pico-Clasp latching connector
  • Provides a basic heatsink to facilitate thermal management

Product status: Active

Operating Temperature Range -40 °C to +85 °C RoHS compliant

The TMPE863 is a standard full PCI Express Mini Card, providing three high speed serial data communication channels.

The serial communication controller is implemented in FPGA logic along with the bus master capable PCIe interface, guaranteeing long term availability and having the option to implement additional functions in the future. Data transfer to and from host memory is handled via TMPE863 initiated DMA cycles for minimum host/CPU intervention.

Each channel has a receive and transmit FIFO of 512 long words (32 bit) per channel for high data throughput.

Several serial communication protocols are supported for each channel, such as asynchronous (with oversampling), isochronous, synchronous and HDLC mode.

Available signal encodings for synchronous data communication are NRZ, NRZI, FM0, FM1 and Manchester.

Available clock sources are 14.7456 MHz for standard asynchronous baud rates, 10 MHz for the 10 Mbit/s synchronous data rate and 24 MHz for other baud or data rates.

Each channel provides various interrupt sources which can be enabled or disabled individually.

The Differential I/O lines for EIA-422, EIA-485 Full-Duplex are terminated with 120 Ω on-board.

The I/O signals are accessible through a 30 pin Pico-Clasp latching connector. For Modules with Pico-Clasp Connector, the TA309 Cable Kit is available.

The TMPE863 provides a basic heatsink to facilitate thermal management. The heatsink can be used to install additional cooling solutions like passive or active heatsinks or to provide a thermal connection to an enclosure.

Mechanical Interface PCI Express Mini Card conforming to PCI Express Mini Card Electromech. Specification, Revision 2.0 Card Type: Full-Mini Card (50.95 mm x 30 mm)
Electrical Interface PCI Express x1 Link conforming to PCI Express Base Specification, Revision 2.1 (Xilinx)
The TMPE863 does not support the USB interface
FPGA Xilinx Artix FPGA
SPI-Flash 128 Mbit SPI-Flash
Number of Channels 3
Signals per Channel RXD±, TXD±, RXCLK±, TXCLK± (plus common GND)
Digital I/O Interface 12 differential EIA-422 / EIA-485 I/O lines
Digital I/O Transceiver 65HVD75D (or compatible)
FIFOs Main Transmit-FIFO per channel: up to 512 DWORD (2 Kbyte)
Main Receive-FIFO per channel: 512 DWORD (2 Kbyte)
SCC Transmit-FIFO per channel: up to 16 Byte
SCC Receive-FIFO per channel: 16 Byte
Maximum Data Rate Synchronous: 10 Mbit/s (Non-DPLL Modes), 2 Mbit/s (DPLL Modes)
Asynchronous: 2 Mbit/s
I/O Connectors 30 pol. Pico-Clasp latching connector
Power Requirements +1.5V Supply: 200mA

+3.3VAUX Supply: 425mA Idle, add appr. 90mA per active Channel (10MHz HDLC)

Temperature Range Operating: -40°C to +85°C

Storage: -40°C to +125°C

MTBF 1 200 000 h

MTBF values shown are based on calculation according to MIL-HDBK-217F and MIL-HDBK-217F Notice 2; Environment: GB 20°C.
The MTBF calculation is based on component FIT rates provided by the component suppliers. If FIT rates are not available, MIL-HDBK-217F and MIL-HDBK-217F Notice 2 formulas are used for FIT rate calculation

Humidity 5 – 95% non-condensing
Weight 13 g

PRODUCT VARIATIONS

TMPE863-10R

3 Channel High Speed Sync/Async Serial Interface

3 programmable EIA-422/EIA-485 interfaces; DMA support; datarates up to 10 Mbit/s; I/O via 30 pos. Pico-Clasp connector

ACCESSORIES

Cable Kit for Modules with Pico-Clasp Connector

SOFTWARE

Device Driver for Synch/Asynch Serial Interface Family

Data Sheet

Data Sheet

Data Sheet - Issue 1.0.0

User Manual

User Manual - Issue 1.0.0

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