VITA 93 – QMC
The VITA 93 – QMC mezzanine card standard, under development by the VITA Standards Organization and expected to be released in spring 2025, is set to revolutionize embedded computing systems. It will bring higher bandwidth, unprecedented modularity, flexibility, and scalability, leading to enhanced system performance and adaptability.
VITA 93 – QMC cards, more compact and powerful than previous standards, offer a single design for air- and conduction-cooled systems, PCIe Gen6 up to x16, IPMI system management, and high-density I/O. Their versatility makes them ideal for a wide range of applications in industrial automation, transportation, testing, medical, and more. TEWS Technologies offers expertise in implementing these solutions with COTS, modified, or custom designs, opening up a world of possibilities.
Leveraging its expertise in PCIe-based solutions like XMC and mPICe, TEWS Technologies wants to position itself as one of the market leaders for the new standard, building up a comprehensive product portfolio covering simple I/O to high-performance FPGAs and various carrier solutions.
For certain applications where the primary use of this might be an I/O interface, I think you can’t get much smaller than a single QMC. I would say this is pretty close to what we can expect at least for the next 10 years.
Dean Holman
President, VITA
Modular
Flexible
Scalable
Advancing Embedded Systems with VITA 93 – QMC: A New Era in Modular I/O Solutions
This white paper explores how the new VITA 93 – QMC standard addresses the inherent challenges in current mezzanine card standards through its innovative QMC architecture, enabling unprecedented flexibility and scalability while maintaining backward compatibility and rugged reliability. It also covers how VITA 93 – QMC builds on lessons learned from previous standards, blending their best features with new capabilities for the future.
Technical Information
Technical Overview
I/O Capabilities
Thermal Management
Upcoming Events
January 13 – 14, 2025
Embedded Tech Trends
San Antonio, TX, USA
TEWS Technologies GmbH will attend the Embedded Tech Trends conference as a sponsor and speaker in San Antonio, Texas, next week. This event brings together industry leaders to share insights and advancements in embedded computing technology.
At the conference, TEWS will present the innovative VITA 93 – QMC mezzanine standard together with Elma Electronic and Acromag.
As active participants in the VITA 93 – QMC working group, we are committed to driving forward the development of this new mezzanine standard and showcasing its potential to transform the embedded computing landscape.
March 11 – 13, 2025
embedded world
Nürnberg, Germany
TEWS Technologies GmbH will exhibit at this year’s embedded world in Nürnberg, Germany. The embedded world The embedded world Conference is a world-leading exhibition offering an unparalleled insight into the whole world of embedded systems.
TEWS Technologies will present the innovative VITA 93- QMC mezzanine standard together with other new product developments.
QMC Starter Kit
Make your first steps with the new VITA 93 – QMC mezzanine concept. The QMC Starter Kit is the perfect solution for gaining first experiences, showcasing, evaluating, and prototyping the true potential.
TEWS Technologies GmbH will release a QMC Starter Kit in the first quarter of 2025. Subscribe to our newsletter to be the first to know when it becomes available and secure early access.
The Starter Kit will include the following:
Quad UART QMC
Dual QMC Carrier
Cable Kit
Device Driver
A Device Driver for Windows will be included to allow applications simple access to the UART QMC module. All functions are well documented in the User Manual and come along with example code.