The FMC (FPGA Mezzanine Card) Mezzanine Modules conform to the ANSI/VITA 57.1 standard, and provide I/O modularity for FPGA processing devices on FMC Carrier Cards.

The need for different front panel I/O functionality within systems is constantly increasing. Typically, this front panel I/O functionality is fixed on 3U or 6U form factor cards. In practice, this means that if you want to change the front panel I/O functionality you have to replace the entire 3U or 6U card. Partial solutions are available with PMC and XMC Mezzanine Modules that provide configurable front panel I/O for 3U and 6U form factor carrier cards, but these still use most of the 3U and 6U carrier card area.

FMCs are new I/O mezzanine modules which connect to, but which are not limited to, 3U and 6U form factor cards.  FMC Mezzanine Modules use a smaller and more modular form factor compared with PMC or XMC mezzanines.  They are usually connected to an FPGA device or other device with a reconfigurable I/O capability.  For example, they may be used on an AMC (Advanced Mezzanine Card) Carrier Card with an FMC site and FPGA for maximum flexibility.

FPGAs provide high pin count interfaces that are able to operate at high data rates up to multiple Gb/s. The state-of-the-art FMC Connector is able to maintain the high performance interface from the FPGA on the carrier card to the I/O on the FMC mezzanine module.

The FMC concept offers versatile modular I/O solutions, which can be used in various applications, environments, and markets. If necessary, double-width modules are available for applications that need additional FPGA carrier card bandwidth, greater front panel space, or a larger PCB area. Additionally, the FMC standard defines a commercial grade mezzanine module and a ruggedized conduction cooled variant.

To inquire about custom FMC designs, please contact TEWS directly at our offices in Germany or the United States. TEWS works closely with OEM and government customers to deliver accelerated time-to-market, long-term product availability and comprehensive product lifecycle management -- from the design stage through manufacturing, testing and beyond to post-sales support.